Contact fuse one time programmable memory

摘要

A fuse structure for a semiconductor integrated circuit (IC) can include a first node comprising a region of a metal layer of an IC manufacturing process and a second node comprising a region of a conductive layer residing on a layer of the IC manufacturing process below the metal layer of the first node. The fuse structure can include a fuse link comprising a conductive material, positioned substantially perpendicular to each of the metal and conductive layers. An upper end of the fuse link couples to the first node and a lower end of the fuse link, that is distal to the upper end, couples to the second node.