发明名称 |
Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process |
摘要 |
In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired. |
申请公布号 |
US8141769(B2) |
申请公布日期 |
2012.03.27 |
申请号 |
US20050989214 |
申请日期 |
2005.07.22 |
申请人 |
OTT MICHAEL;PAUL UWE;SINGER ROBERT;VOLEK ANDREAS;SIEMENS AKTIENGESELLSCHAFT |
发明人 |
OTT MICHAEL;PAUL UWE;SINGER ROBERT;VOLEK ANDREAS |
分类号 |
B23K26/34;B23K31/02 |
主分类号 |
B23K26/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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