发明名称 Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process
摘要 In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
申请公布号 US8141769(B2) 申请公布日期 2012.03.27
申请号 US20050989214 申请日期 2005.07.22
申请人 OTT MICHAEL;PAUL UWE;SINGER ROBERT;VOLEK ANDREAS;SIEMENS AKTIENGESELLSCHAFT 发明人 OTT MICHAEL;PAUL UWE;SINGER ROBERT;VOLEK ANDREAS
分类号 B23K26/34;B23K31/02 主分类号 B23K26/34
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