发明名称 In-mould molding touch module and method for manufacturing the same
摘要 An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
申请公布号 US8143905(B2) 申请公布日期 2012.03.27
申请号 US201113085499 申请日期 2011.04.13
申请人 LEE MIN-YI;TPK TOUCH SOLUTIONS INC. 发明人 LEE MIN-YI
分类号 G01R27/26 主分类号 G01R27/26
代理机构 代理人
主权项
地址