发明名称 High impedance electrical connection via
摘要 Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.
申请公布号 US8143976(B2) 申请公布日期 2012.03.27
申请号 US20090607027 申请日期 2009.10.27
申请人 WYLAND CHRISTOPHER P.;XILINX, INC. 发明人 WYLAND CHRISTOPHER P.
分类号 H01P7/08;H03H7/38 主分类号 H01P7/08
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