发明名称 |
High impedance electrical connection via |
摘要 |
Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via. |
申请公布号 |
US8143976(B2) |
申请公布日期 |
2012.03.27 |
申请号 |
US20090607027 |
申请日期 |
2009.10.27 |
申请人 |
WYLAND CHRISTOPHER P.;XILINX, INC. |
发明人 |
WYLAND CHRISTOPHER P. |
分类号 |
H01P7/08;H03H7/38 |
主分类号 |
H01P7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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