发明名称 |
Semiconductor device with plate-shaped component |
摘要 |
The invention provides a semiconductor device including a plurality of stacked semiconductor chips, which offers a higher degree of freedom in selecting a chip size of the semiconductor chip and arranging the routing, and increase of the reliability and speed in signal transmission between the semiconductor chips. The semiconductor device includes a lower semiconductor chip, an upper semiconductor chip and a silicon spacer formed between the lower semiconductor chip and the upper semiconductor chip and including a projecting portion projecting farther outward than an outer periphery of the upper semiconductor chip, and the silicon spacer includes through electrodes and reroutings.
|
申请公布号 |
US8143716(B2) |
申请公布日期 |
2012.03.27 |
申请号 |
US20050088836 |
申请日期 |
2005.03.25 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
KAWANO MASAYA;TAKAHASHI NOBUAKI |
分类号 |
H01L23/04;H01L25/18;H01L21/60;H01L23/02;H01L23/48;H01L23/498;H01L23/52;H01L23/62;H01L25/065;H01L25/07 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|