| 发明名称 |
ELECTRONIC PART MOUNTING SUBSTRATE, ELECTRONIC PART, AND SEMICONDUCTOR DEVICE |
| 摘要 |
An infrared emissive first insulating portion, which radiates heat transferred from a WCSP corresponding to an electronic part to a first conductive portion as infrared radiation with high efficiency, is formed on the first conductive portion lying in a through hole provided in a printed wiring board with the WCSP mounted thereon. |
| 申请公布号 |
KR101128308(B1) |
申请公布日期 |
2012.03.26 |
| 申请号 |
KR20040048053 |
申请日期 |
2004.06.25 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L23/40;H05K3/28;H01L23/12;H01L23/28;H01L23/36;H01L23/367;H01L23/467;H01L23/498;H01L23/50;H02G3/08;H05K1/02;H05K1/11;H05K1/18;H05K3/34;H05K5/00 |
主分类号 |
H01L23/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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