| 摘要 |
PURPOSE: A heat radiating type semiconductor package is provided to prevent the contamination of a heat radiating plate due to a resin material by preventing the flashing phenomenon of the resin material injected into a mold. CONSTITUTION: At least one semiconductor chip is loaded on a substrate(100) using a wire(124). A molding part(130) is molded by a resin material in order to protect the semiconductor chip. One end part of a heat spreader(140) is in contact with the external side of the semiconductor chip and radiates heat to the outside. The heat spreader is composed of a flat part(140a) and a sloped part(140b). The flat part is bonded with the upper side of the semiconductor chip using adhesive. The sloped part is expanded from the external edge of the flat part, and the external end part of the sloped part is in contact with the upper side of the molding part. |
