| 摘要 |
PURPOSE: A double sided heat radiation circuit board and a manufacturing method thereof are provided to prevent damage due to high heat by transmitting high heat from LED lamps mounted on a first copper layer and a second copper layer to an aluminum layer. CONSTITUTION: A first copper layer(11), a first heat radiation insulation resin layer(12), and an aluminum layer(13) are successively laminated on a disk(10) in a vertical direction. A second heat radiation insulation resin layer(22) is laminated on the upper side of the aluminum layer. A second copper layer(23) is formed on the upper side of the second heat radiation insulation resin layer. The first heat radiation insulation resin layer and the second heat radiation insulation resin layer are made of thermosetting resin and include titanium.
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