发明名称 OPTICAL PACKAGE AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PURPOSE: An optical package and a manufacturing method thereof are provided to arrange a package following an existing lead frame method into a package using a tape substrate, thereby reducing the volume and thickness of a total package. CONSTITUTION: An insulating layer(110) including holes(115,116) is arranged on a metal layer(120). A metal reflective layer(130) is arranged on the surface of the insulating layer. A plating layer(140) is arranged on the metal layer exposed by the metal reflective layer and hole. An optical device(150) is mounted on the plating layer exposed by the hole. A connection part(160) electrically connects the optical device and a circuit pattern. A resin part(170) buries the optical device and connection part.</p>
申请公布号 KR101129002(B1) 申请公布日期 2012.03.23
申请号 KR20100039715 申请日期 2010.04.28
申请人 发明人
分类号 H01L33/48;H01L33/60 主分类号 H01L33/48
代理机构 代理人
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