发明名称 SIDE VIEW OPTICAL PACKAGE AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PURPOSE: A side view optical package and a manufacturing method thereof are provided to reduce the volume and the thickness of an entire package by forming a package with a lead frame mode into a side view optical package using a tape substrate. CONSTITUTION: An insulating layer(110), which includes a hole, is formed on a metal layer(120). A solder resist layer is formed in the upper side of the insulating layer. A connection unit(160) electrically connects an optical device and a circuit pattern. A resin unit(170) fills an optical device and the connection unit. A bent unit(180) is formed in an area in which the resin unit is not formed.</p>
申请公布号 KR101128991(B1) 申请公布日期 2012.03.23
申请号 KR20100040277 申请日期 2010.04.29
申请人 发明人
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
代理机构 代理人
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