| 摘要 |
A semiconductor LED package for backlight of a display apparatus is provided to generate white light of desired chromaticity while the same current or voltage is applied to each LED chip by eliminating the necessity of a conventional circuit for controlling applied voltage or current. A plurality of LED chips are formed on a substrate(52) wherein at least two of the LED chips have different light emitting areas, composed of red, green and blue color LED chips(54,56,58). A transparent molding body is formed on the substrate, surrounding the plurality of LED chips and made of synthetic resin. |
