| 摘要 |
PURPOSE: An LED package with a heat radiation structure is provided to improve heat radiation by exposing a rear side of a cup unit to the outside through the lower side of a molding unit. CONSTITUTION: A first lead frame(12) with a plate shape includes a concave cup unit(125) for mounting an LED chip(2). A second lead frame(14) with the plate shape is separated from the first lead frame and is connected to the LED chip with the wiring. A transmissive molding unit(20) supports the first lead frame and the second lead frame and covers the LED chip. The cup unit is exposed to the outside on the lower side of the molding unit. The rear of the cup unit and the rear of the end contacts form the same plane. The molding unit is integrated with the lens unit protruded from the upper side. |
