发明名称 METHODS OF FORMING INTEGRATED CIRCUITS
摘要 A method of forming an integrated circuit includes forming a gate structure over a substrate. At least one silicon-containing layer is formed in source/drain (S/D) regions adjacent to sidewalls of the gate structure. An N-type doped silicon-containing layer is formed over the at least one silicon-containing layer. The N-type doped silicon-containing layer has an N-type dopant concentration higher than that of the at least one silicon-containing layer. The N-type doped silicon-containing layer is annealed so as to drive N-type dopants of the N-type doped silicon-containing layer to the S/D regions.
申请公布号 US2012070954(A1) 申请公布日期 2012.03.22
申请号 US201113274558 申请日期 2011.10.17
申请人 FUNG KA-HING;LU WEI-YUAN;TSAI HAN-TING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 FUNG KA-HING;LU WEI-YUAN;TSAI HAN-TING
分类号 H01L21/336 主分类号 H01L21/336
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