发明名称 |
METHODS OF FORMING INTEGRATED CIRCUITS |
摘要 |
A method of forming an integrated circuit includes forming a gate structure over a substrate. At least one silicon-containing layer is formed in source/drain (S/D) regions adjacent to sidewalls of the gate structure. An N-type doped silicon-containing layer is formed over the at least one silicon-containing layer. The N-type doped silicon-containing layer has an N-type dopant concentration higher than that of the at least one silicon-containing layer. The N-type doped silicon-containing layer is annealed so as to drive N-type dopants of the N-type doped silicon-containing layer to the S/D regions.
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申请公布号 |
US2012070954(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201113274558 |
申请日期 |
2011.10.17 |
申请人 |
FUNG KA-HING;LU WEI-YUAN;TSAI HAN-TING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
FUNG KA-HING;LU WEI-YUAN;TSAI HAN-TING |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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