发明名称 |
MULTI-DIE MEMS PACKAGE |
摘要 |
This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via. |
申请公布号 |
WO2012037492(A2) |
申请公布日期 |
2012.03.22 |
申请号 |
WO2011US51994 |
申请日期 |
2011.09.16 |
申请人 |
BRYZEK, JANUSZ;BLOOMSBURGH, JOHN GARDNER;ACAR, CENK |
发明人 |
BRYZEK, JANUSZ;BLOOMSBURGH, JOHN GARDNER;ACAR, CENK |
分类号 |
B81C1/00;B81B7/00;H01L23/52 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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