| 摘要 |
PURPOSE: A dicing-die bonding film is provided to suppress dislocation of a semiconductor chip while preventing destruction of the semiconductor chip due to exfoliation electrification in a picking-up process. CONSTITUTION: A dicing film(11) is comprised by laminating an adhesive layer(2) on a base material(1). A die bond film(3) is arranged on the adhesive layer. The die bond film includes conductive particles. The average diameter of the conductive particles is in a range of 0.01 to 10 μm. The base material is used as a parent body of a dicing-die bonding film(10). |
