发明名称 |
ELECTRODE STRUCTURE, WIRING BODY, ADHESIVE CONNECTION STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING SAME |
摘要 |
<p>There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.</p> |
申请公布号 |
KR20120028293(A) |
申请公布日期 |
2012.03.22 |
申请号 |
KR20117004267 |
申请日期 |
2010.04.13 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
发明人 |
YAMAMOTO MASAMICHI;NAKATSUGI KYOUICHIROU;YAMAGUCHI TAKASHI;KAWAKAMI SHIGEKI;KIMURA MICHIHIRO |
分类号 |
H05K1/14;H05K3/34;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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