| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method for a wafer by which a wafer whose center part is ground to be thin with a ring-shaped reinforcement part remaining in the outer circumference can be divided into individual devices without damaging the handleability at the time of a dicing process. <P>SOLUTION: When dividing into individual devices a wafer 1 whose surface is configured by device regions 10 of devices partitioned by division schedule lines being surrounded by an outer circumferential excessive region, a ring-shaped reinforcement part 13 is formed in the outer circumferential side of the device region 10 by grinding the reverse side of the device region 10, and a dicing tape 4 is adhered to the reverse side of the wafer 1 to irradiate the wafer 1 with a laser beam 61a from the surface side to divide the wafer 1 into devices while a decomposition point is formed in the ring-shaped reinforcement part 13 and the dicing tape 4 is extended to decompose the ring-shaped reinforcement part 13 with the decomposition point as a starting point to be separated from the device region 10, widening the gap between the adjacent devices. When dividing the wafer into individual devices, the ring-shaped reinforcement part 13 remains, so the handleability in a division process cannot be damaged. <P>COPYRIGHT: (C)2012,JPO&INPIT |
