| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent streaky defects caused by peeling and redepositing of a resist-surface insolubilization layer in an end area of a substrate from occurring. <P>SOLUTION: A method of drying a substrate comprises: supplying a first air flow 4 downwardly in an inclined direction onto the substrate, from an upper blowing portion 2a positioned above a virtual plane 1b including a center plane positioned in a center of a thickness of the substrate 1; supplying a second air flow 5 upwardly in an inclined direction onto the substrate, from a lower blowing portion 2b positioned below the virtual plane, while moving relatively the substrate and the upper and lower blowing portions so that the substrate, from the end area as a front of the substrate, passes between the upper blowing portion and the lower blowing portion; and controlling the first and second air flows such that a velocity component of the second air flow in an upward direction perpendicular to the virtual plane is smaller than a velocity component of the first air flow in a downward direction perpendicular to the virtual plane. <P>COPYRIGHT: (C)2012,JPO&INPIT |
