| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently cool a semiconductor element having structural stability in a cooling structure of the semiconductor element. <P>SOLUTION: A base plate 110 has a plural heat dissipating projection parts 111 projecting toward a main face of an opposed plate on the other main face. The other main face of the base plate 110 and the main face of the opposed plate are connected with each other via two flow path side walls 130A, 130B, so as to form a flow inlet 191 and a flow outlet 192 of a coolant flow path 190 having a pressure resistance region 194 which is one part of the coolant flow path 190, at which the plural heat dissipating projection parts 111 are positioned, between them. The coolant flow path 190 is formed so that a static pressure applied to the base plate 110 at a center of the pressure resistance region 194 is lower than a static pressure applied to the base plate 110 at an end of the pressure resistance region 194 in a direction connecting the flow inlet 191 and the flow outlet 192. <P>COPYRIGHT: (C)2012,JPO&INPIT |
