| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board capable of improving design flexibility. <P>SOLUTION: The manufacturing method of the wiring board comprises a bonding step S10 of bonding a first substrate and a second substrate and wiring formation steps S20 to S70 of collectively forming wiring on the mutually bonded first and second substrates. <P>COPYRIGHT: (C)2012,JPO&INPIT |
