| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to eliminate a need of a substrate, thereby reducing costs for manufacturing the semiconductor package. CONSTITUTION: A mold includes a protruding bar in a cavity. The mold is filled with an insulation material solution. One side on which an electrode pad(102) is placed and the other side of a semiconductor chip are immersed in the insulation material solution wherein one side faces the other side. A semiconductor chip and an insulation material attached to the semiconductor chip are separated from the mold. A via hole of an insulation hole formed by a bar is filled with a conductive filling material. A contact pad(350) is formed on one end or both ends of the conductive filling material. |
