摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus that is excellent in handleability of various types and has excellent comprehensive manufacturing efficiency. <P>SOLUTION: A component mounting apparatus comprises: a substrate transfer mechanism transporting a substrate transferred from upstream side, which is formed by arranging in parallel a first substrate conveyance unit 2A and a second substrate conveyance unit 2B with variable conveyance width; two individual component mounting areas [MA1] and [MA2] provided for the first substrate conveyance unit 2A to perform a component mounting operation; two individual component mounting areas [MB1] and [MB2] provided for the second substrate conveyance unit 2B to perform a component mounting operation; substrate detection sensors 14A, 14B, 15A and 15B provided in the individual component mounting areas [MA1], [MA2], [MB1], and [MB2] to perform positioning of the substrate; and a substrate underside supporting part provided individually. <P>COPYRIGHT: (C)2012,JPO&INPIT |