| 发明名称 |
FILM FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film for a semiconductor device capable of preventing occurrence of transfer marks on an adhesive film when semiconductor device film comprising a cover film on which an adhesive film with a dicing sheet having the adhesive film laminated on a dicing film is laminated at predetermined intervals is rewound into a roll. <P>SOLUTION: The film for a semiconductor device comprises a cover film on which an adhesive film with a dicing sheet having the adhesive film laminated on a dicing film is laminated at predetermined intervals. The ratio Ea/Eb of tensile storage elastic modulus Ea of the adhesive film at 23°C to the tensile storage elastic modulus Eb of the cover film at 23°C is in the range of 0.001 to 50. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012059767(A) |
申请公布日期 |
2012.03.22 |
| 申请号 |
JP20100199021 |
申请日期 |
2010.09.06 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
AMANO YASUHIRO;HAYASHI MIKI |
| 分类号 |
H01L21/52;C09J7/02;C09J133/00;C09J201/00 |
主分类号 |
H01L21/52 |
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