发明名称 |
DICING DIE BOND FILM, METHOD OF MANUFACTURING DICING DIE BOND FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
The present invention aims to provide a dicing die bond film that is capable of suppressing peeling of the dicing die bond film from a dicing ring. The present invention provides a dicing die bond film in which the pressure-sensitive adhesive layer contains a polymer formed by performing an addition reaction on a specific acrylic polymer with a specific isocyanate compound, and a specific crosslinking agent, and the specific peeling adhesive power of a portion of the pressure-sensitive adhesive layer where the dicing ring is pasted is 1.0 N/20 mm tape width or more and 10.0 N/20 mm tape width or less, the tensile storage modulus at 23° C. of the portion where the dicing ring is pasted is 0.05 MPa or more and less than 0.4 MPa, and the die bond film is pasted to the pressure-sensitive adhesive layer after irradiation with an ultraviolet ray.
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申请公布号 |
US2012070960(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201113237548 |
申请日期 |
2011.09.20 |
申请人 |
MURATA SHUHEI;MATSUMURA TAKESHI;YANAGI YUICHIRO |
发明人 |
MURATA SHUHEI;MATSUMURA TAKESHI;YANAGI YUICHIRO |
分类号 |
H01L21/78;B32B7/12;B32B37/02;B32B37/06;B32B37/12;B32B37/14 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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