发明名称 BINDING OF CONSTITUENTS HAVING A HIGH MOBILITY IN AN ELECTRONIC CONNECTION
摘要 A method of creating an electrical contact involves locating a barrier material at a location for an electrical connection, providing an electrically conductive bonding metal on the barrier material, the electrically conductive bonding metal having a diffusive mobile component, the volume of barrier material and volume of diffusive mobile component being selected such that the barrier material volume is at least 20% of the volume of the combination of the barrier material volume and diffusive mobile component volume. An electrical connection has an electrically conductive bonding metal between two contacts, a barrier material to at least one side of the electrically conductive bonding metal, and an alloy, located at an interface between the barrier material and the electrically conductive bonding metal. The alloy includes at least some of the barrier material, at least some of the bonding metal, and a mobile material.
申请公布号 KR101119761(B1) 申请公布日期 2012.03.22
申请号 KR20097022612 申请日期 2008.06.05
申请人 发明人
分类号 H01L21/60;B23K35/30;H01L21/98;H01L23/485 主分类号 H01L21/60
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