摘要 |
<p>A trench vertical double diffused metal oxide semiconductor transistor includes, in part, a semiconductor substrate, an epitaxial layer formed above the substrate, a well region formed in the epitaxial layer, a multitude of trenches formed in the well region with each trench having formed therein a gate oxide layer and a polysilicon gate, a multitude of contact holes formed in the well region wherein each contact hole is positioned between a pair of adjacent trenches and has a metal disposed therein, a multitude of body contact regions positioned below the contact holes, and a multitude of source regions formed in the well region. Each source region is positioned between a trench and a contact hole. The substrate, the epitaxial layer, and the source regions are of the first conductivity type. The well region and the body contact regions are of the second conductivity type opposite the first conductivity type.</p> |
申请人 |
CSMC TECHNOLOGIES FAB1 CO., LTD.;CSMC TECHNOLOGIES FAB2 CO., LTD.;WANG, GENYI;WO, TZONG SHIANN |
发明人 |
WANG, GENYI;WO, TZONG SHIANN |