| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device, which is capable of suppressing dimensional variation of a tape due to moisture absorption, and a method for manufacturing the same. <P>SOLUTION: A tape carrier 10 for a semiconductor device includes: a flexible insulating substrate 1; a wiring pattern 2 formed on a surface of the insulating substrate and having an inner lead 3 and outer leads 4 and 5; an insulating protective material 6 which is formed on a surface of the wiring pattern 2 and insulates and protects the wiring pattern 2; and a rear-surface substrate 8 provided on a rear surface of the insulating substrate 1 and comprising a low-water-absorbing material layer made of an insulating material having a lower water absorption rate than the insulating substrate 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
