| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily manufacture a highly reliable semiconductor module at a high yield rate. <P>SOLUTION: Two diode chips 12 and 13 are mounted near the center part of a metal base 11. A lead 14 is connected to the upper face of the diode chip 12 and a lead 15 is connected to the upper face of the diode chip 13, respectively, and the upper part of the leads 14 and 15 is projected from the upper face of a mold layer 20. The lead 14 is fixed on the metal base 11 on the right side of the diode chip 12 in Figure 1 through an insulation part 16, and the lead 15 is fixed on the metal base 11 on the right side of the diode chip 13 in Figure 1 through an insulation part 17. Two convexes 111 and 112 are formed on the metal base 11 corresponding to the diode chips 12 and 13 to be mounted on the metal base 11. On the upper face of the convexes 111 and 112, recesses 113 and 114 are formed, respectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
