发明名称 |
COOLING DEVICE USING EHD FLUID |
摘要 |
<P>PROBLEM TO BE SOLVED: To enhance the cooling efficiency of a heating element by applying a voltage on an EHD fluid to devise an arrangement of a pump that causes the EHD fluid to flow, in a cooling device for cooling the heating element by using the EHD fluid. <P>SOLUTION: The cooling device is provided with: a cooling part 12 for receiving heat generated by the heating elements 2-4 by conduction; a heat radiating part 13 for radiating heat to the outside; and a connecting part 11 connected to the cooling part 12 and the heat radiating part 13 for transferring heat from the cooling part 12 to the heat radiating part 13. The EHD fluid circulates a passage formed in the cooling part 12, the connecting part 11 and the heat radiating part 13. The pumps applying a voltage to the EHD fluid are arranged at a plurality of positions. The number of pumps per unit volume in the passage in the cooling part 12 are lager than the number of pumps per unit volume in the passage in the connecting part 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012057872(A) |
申请公布日期 |
2012.03.22 |
申请号 |
JP20100202185 |
申请日期 |
2010.09.09 |
申请人 |
DENSO CORP;TOKYO INSTITUTE OF TECHNOLOGY |
发明人 |
YAMASHITA KAZUYA;SAKIMICHI TORU;OBARA KIMIKAZU;YOKOTA SHINICHI;KIN SHUNKAN;EDAMURA KAZUYA |
分类号 |
F25B21/00;H01L23/473;H05K7/20 |
主分类号 |
F25B21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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