| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable an adhesive tape to be pasted with a recess of the adhesive tape aligned to an adherend such as a semiconductor wafer or the like while simplifying a structure. <P>SOLUTION: A sheet pasting device 10 comprises: support means 11 which has a support surface 21 which can support a semiconductor wafer W; delivery means 12 which delivers an adhesive sheet S so as to face the support surface 21; recess detection means 13 which detects the location of a recess C formed on the adhesive sheet S; a multi-joint robot 15 for placing the semiconductor wafer W on the support surface 21 and a conveyance arm 82; and pressing means 18 which presses and pastes the adhesive sheet S to the semiconductor wafer W supported by the support means 11. The multi-joint robot 15 operates based on the detection result of the recess detection means 13 and places the semiconductor wafer W on the support surface 21 so that the center location DC of the recess matches the center location WC of the semiconductor wafer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
