| 摘要 |
PURPOSE: An LED module is provided to efficiently emit heat generated from an LED chip through a sub heat emitting plate, thereby stably operating the LED chip. CONSTITUTION: A circuit board comprises electrode pads and heat emitting holes. The heat emitting holes vertically penetrate an area on which an LED chip is mounted. A sub heat emitting plate(200) is extended from inner circumferences of the heat emitting holes to the bottom of the circuit board. A heat emitting silicon(300) is attached onto the bottom of the sub heat emitting plate to receive heat of the sub heat emitting plate. A main heat emitting plate(400) is attached to the bottom of the heat emitting silicon to emit heat transferred through the heat emitting silicon to the outside. The bottom of an LED chip contacts the top of the sub heat emitting plate.
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