EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to reduce process time and cost more than a method using a laser by forming a cavity with an exposure and development process. CONSTITUTION: A cavity is formed in a core layer(110). An adhesive layer(170) for fixing a chip(190) is spread on a top part of a copper foil layer(150). The chip is arranged on the cavity of the core layer arranged on the top part of the copper foil layer spread by the adhesive layer. An insulating layer(210) is formed between the cavity and the chip and on the top part of the core layer. A circuit layer(230) is formed on the insulating layer. The core layer is made of a photosensitive composition including a light sensitive monomer and a photoinitiator.