| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving adhesive strength of micro bumps to a semiconductor element side. <P>SOLUTION: A semiconductor device comprises: a semiconductor element 2 and electrode pads 20 of the semiconductor element; a buffer coat film 40 having openings 41 to expose the electrode pads 20; and micro bumps 50 electrically connected to the electrode pads through the openings. The contact area between each micro bump and a side surface 41b of each opening is larger than that between each micro bump and a bottom surface 60a of each opening. <P>COPYRIGHT: (C)2012,JPO&INPIT |
