| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which a circuit can be formed using a electronic component mounting surface thereof effectively, and the degree of freedom is high in circuit design. <P>SOLUTION: The multilayer printed wiring board comprises: a first printed wiring board 1 formed on a main surface of a first insulating substrate 11 and having a first circuit pattern 12 including a first contact 13; a second printed wiring board 2 laminated on a main surface side of the first printed wiring board 1 and having a second circuit pattern 22 formed on a main surface of a second insulating substrate 21; and a third printed wiring board 3 laminated on a main surface side of the second printed wiring board 2 and having a third circuit pattern 32 including a second contact 33 formed on a main surface of a third insulating substrate 31. The multilayer printed wiring board further comprises: a contact 42 extending along the main surface of the second printed wiring board 2; and an interlayer connection member 4 which connects the first contact 13 and the second contact 33. <P>COPYRIGHT: (C)2012,JPO&INPIT |
