发明名称 CAMERA MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a camera module that can reduce a mounting space on an electronic apparatus having a camera module and a proximity sensor. <P>SOLUTION: A camera module 11 includes a sensor board 17, a lens holder 16, a lens 14 and an infrared cut filter 15. The sensor board 17 comprises a board 13 having a solid state image pickup element 12 and a light reception part 22 of a proximity sensor. The lens holder 16, which is mounted on the sensor board 17 so as to cover the solid state image pickup element 12 and the proximity sensor light reception part 22, comprises a tubular part 18 and a top plate 19 having an opening 20 in a substantially central portion. The lens 14 and the infrared cut filter 15 are each formed in the lens holder 16. The infrared cut filter 15 is formed in a region except above the proximity sensor light reception part 22. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012060362(A) 申请公布日期 2012.03.22
申请号 JP20100200893 申请日期 2010.09.08
申请人 TOSHIBA CORP 发明人 KOBAYASHI MASARU
分类号 H04N5/225;G02B7/02 主分类号 H04N5/225
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