| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat transfer board superior in heat transfer efficiency. <P>SOLUTION: The heat transfer board 10 includes: a heat transfer board body 1 with a recess 1g on its surface; a tube 3 for a heat medium arranged in the recess 1g and having at least one outer circumference groove 4 extending in a direction perpendicular to a longitudinal direction of the tube; and a lid 2 bonded with the heat transfer body 1 by lidding an opening of the recess 1g where the tube 3 for the heat medium arranged and performing friction stir welding a matching part with the heat transfer body 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
