| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an element with improved sulfide resistance by increasing flatness of a surface of a thick film conductor layer. <P>SOLUTION: A substrate 10 for mounting an element has such a structure that a thick film conductor layer 2 which is a terminal for connecting the element is formed on the surface of a ceramic substrate 1. The thick film conductor layer 2 is made of metal mainly of Ag or Cu, and formed by printing and firing metallic paste. The surface of the thick film conductor layer 2 is flattened to surface roughness Ra of 0.02 μm or less by wet-blast treatment. A Ni/Au plating layer 3 is formed on the thick film conductor layer 2, and the surface of the thick film conductor layer 2 is completely covered without a clearance. <P>COPYRIGHT: (C)2012,JPO&INPIT |
