发明名称 SUBSTRATE PROCESSING METHOD AND METHOD OF MANUFACTURING CRYSTALLINE SILICON CARBIDE (SIC) SUBSTRATE
摘要 The present invention provides a method of processing a substrate and a method of manufacturing a silicon carbide (SiC) substrate in which, when annealing processing is performed on a crystalline silicon carbide (SiC) substrate, the occurrence of surface roughness is suppressed. A substrate processing method according to an embodiment of the present invention includes a step of performing plasma irradiation on a single crystal silicon carbide (SiC) substrate (1) and a step of performing high temperature heating processing on the single crystal silicon carbide (SiC) substrate (1) in which the plasma irradiation is performed.
申请公布号 US2012070968(A1) 申请公布日期 2012.03.22
申请号 US201113234594 申请日期 2011.09.16
申请人 SHIBAGAKI MASAMI;SATOH MASATAKA;SUGIMOTO TAKAHIRO;SATOH AKEMI;CANON ANELVA CORPORATION 发明人 SHIBAGAKI MASAMI;SATOH MASATAKA;SUGIMOTO TAKAHIRO;SATOH AKEMI
分类号 H01L21/265;H01L21/26 主分类号 H01L21/265
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