发明名称 |
SUBSTRATE PROCESSING METHOD AND METHOD OF MANUFACTURING CRYSTALLINE SILICON CARBIDE (SIC) SUBSTRATE |
摘要 |
The present invention provides a method of processing a substrate and a method of manufacturing a silicon carbide (SiC) substrate in which, when annealing processing is performed on a crystalline silicon carbide (SiC) substrate, the occurrence of surface roughness is suppressed. A substrate processing method according to an embodiment of the present invention includes a step of performing plasma irradiation on a single crystal silicon carbide (SiC) substrate (1) and a step of performing high temperature heating processing on the single crystal silicon carbide (SiC) substrate (1) in which the plasma irradiation is performed.
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申请公布号 |
US2012070968(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201113234594 |
申请日期 |
2011.09.16 |
申请人 |
SHIBAGAKI MASAMI;SATOH MASATAKA;SUGIMOTO TAKAHIRO;SATOH AKEMI;CANON ANELVA CORPORATION |
发明人 |
SHIBAGAKI MASAMI;SATOH MASATAKA;SUGIMOTO TAKAHIRO;SATOH AKEMI |
分类号 |
H01L21/265;H01L21/26 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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