SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

摘要

This semiconductor package (1) comprises: a wiring board (2); a semiconductor element (3) joined to one surface of the wiring board (2); a first reinforcement member (4) that is joined to a section of the surface of the wiring board (2) on the semiconductor element (3) side where the semiconductor element (3) is not joined, and that has a smaller coefficient of thermal expansion than that of the wiring board (2); a wiring board (301) that is provided on the side opposite to the wiring board (2) with respect to the first reinforcement member (4), and that is joined to the wiring board (2) via at least two metal bumps (400); and a semiconductor element (305) joined to the surface of the wiring board (301) on the side opposite to the wiring board (2). The semiconductor element (3) either touches or does not touch the wiring board (301).