发明名称 |
SILICON ETCHING FLUID AND METHOD FOR PRODUCING TRANSISTOR USING SAME |
摘要 |
The present invention is a method for producing a transistor having a laminate formed from at least a high dielectric material film and a metal gate by a method for eliminating a dummy gate formed from silicon and substituting a metal gate containing hafnium, zirconium, titanium, tantalum, or tungsten wherein etching of the dummy gate formed from silicon is used. Specifically, the present invention is a silicon etching fluid containing 0.1 - 40% by weight of an alkali compound that is at least one selected from ammonia, diamine, and a polyamine represented by the general formula (1), a prescribed polyhydric alcohol, and 0.01 - 40% by weight of a polyhydric alcohol that is at least one selected from saccharides that are not reductive, as well as 40 - 99.89% by weight water and a method for producing a transistor using the same. |
申请公布号 |
WO2012035888(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
WO2011JP66998 |
申请日期 |
2011.07.26 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC.;SHIMADA, KENJI;MATSUNAGA, HIROSHI |
发明人 |
SHIMADA, KENJI;MATSUNAGA, HIROSHI |
分类号 |
H01L21/308;H01L21/28;H01L21/306;H01L21/336;H01L21/8234;H01L27/088;H01L29/423;H01L29/49;H01L29/78 |
主分类号 |
H01L21/308 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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