发明名称 SILICON ETCHING FLUID AND METHOD FOR PRODUCING TRANSISTOR USING SAME
摘要 The present invention is a method for producing a transistor having a laminate formed from at least a high dielectric material film and a metal gate by a method for eliminating a dummy gate formed from silicon and substituting a metal gate containing hafnium, zirconium, titanium, tantalum, or tungsten wherein etching of the dummy gate formed from silicon is used. Specifically, the present invention is a silicon etching fluid containing 0.1 - 40% by weight of an alkali compound that is at least one selected from ammonia, diamine, and a polyamine represented by the general formula (1), a prescribed polyhydric alcohol, and 0.01 - 40% by weight of a polyhydric alcohol that is at least one selected from saccharides that are not reductive, as well as 40 - 99.89% by weight water and a method for producing a transistor using the same.
申请公布号 WO2012035888(A1) 申请公布日期 2012.03.22
申请号 WO2011JP66998 申请日期 2011.07.26
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC.;SHIMADA, KENJI;MATSUNAGA, HIROSHI 发明人 SHIMADA, KENJI;MATSUNAGA, HIROSHI
分类号 H01L21/308;H01L21/28;H01L21/306;H01L21/336;H01L21/8234;H01L27/088;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/308
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