SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

摘要

A semiconductor package, an electronic device, and an electronic system employing the same are provided. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip structure. A first PCB land region is provided on a first surface of the PCB. A plurality of first chip land regions are provided on a first surface of the semiconductor chip structure which faces the first surface of the PCB. A first connection structure for electrically connecting the first PCB land region to the plurality of first chip land regions is provided.