发明名称 |
LIQUID CRYSTAL POLYMER LAYER FOR ENCAPSULATION AND IMPROVED HERMITICITY OF CIRCUITIZED SUBSTRATES |
摘要 |
A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of each PTFE layer. A layer of liquid crystal polymer (LCP) is placed on both layers of etched copper foil. An external layer of etched copper foil is placed on the external surface of the LCP layers. |
申请公布号 |
US2012069288(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US20100884392 |
申请日期 |
2010.09.17 |
申请人 |
DAS RABINDRA;ROWLANDS MICHAEL;ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
DAS RABINDRA;ROWLANDS MICHAEL |
分类号 |
G02F1/1333;B32B38/10 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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