| 摘要 |
<p>One example of a semiconductor device set forth in the present invention is provided with: a protective film (1) which has an opening that exposes a portion of the surface of an electrode pad (4), and covers the surface of the electrode pad (4) except for the opening thereof; and a bump (6) that is electrically connected to the electrode pad (4) through the opening of the protective film (1), and that has an externally exposed portion in the range of the area of the electrode pad (4). A probe notch (7), which comes into contact with the electrode pad (4) in order to test electrical characteristics, is formed on the electrode pad (4), and the probe notch (7) is positioned in the area where the protective film (1) is formed and is covered by the protective film (1).</p> |
