发明名称 ANISOTROPIC CONDUCTIVE FILM PRESSURE-BONDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film pressure-bonding apparatus on which cutting means is easily installed. <P>SOLUTION: A tape cutting device 26 is configured to include: a circular rotary blade 65; and a cutting backup 57 for supporting, from the side of a base tape Bt, a part of a tape member T guided by a plurality of guide rollers 24. The rotary blade 65 pressed against an anisotropic conductive film Acf of the tape member T supported by the cutting backup 57 is rolled in a width direction of the tape member T to cut the anisotropic conductive film Acf. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059799(A) 申请公布日期 2012.03.22
申请号 JP20100199609 申请日期 2010.09.07
申请人 PANASONIC CORP 发明人 YAMADA SHINGO
分类号 H01L21/60;G02F1/1345;H05K13/04 主分类号 H01L21/60
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