| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling method that efficiently cools a group of electronic components which form a complicated mounting surface in an electronic apparatus. <P>SOLUTION: An electronic apparatus 10 comprises: one or more electronic components 21 and 22 mounted on a wiring board 11; and a heat radiation unit 12 placed above the electronic components 21 and 22. Further, the electronic apparatus 10 comprises: insulative powder 30 which fills clearances formed among the wiring board 11, the electronic components 21 and 22, and the heat radiation unit 12. The power 30 allows heat to be efficiently transported from the electronic components 21 and 22 to the heat radiation unit 12. The insulative power 30, for example, is composed of ceramic power having boron nitride or aluminium nitride. <P>COPYRIGHT: (C)2012,JPO&INPIT |
