| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board with an enhanced degree of freedom of wiring routing, which decreases connection points between wiring boards, thereby contributing to reduced size and thickness of equipment. <P>SOLUTION: The printed wiring board comprises: a flexible wiring board having wiring on one surface of an insulating substrate, a device hole, and a flying lead formed by allowing at least a part of the wiring to protrude in the device hole; and a stacked wiring section of one or more layers on the flexible wiring board except for the device hole. A part or the whole of the wiring and the stacked wiring section is covered with an integral continuous protective layer. A contact pad electrically connected to the wiring is exposed to an opposite surface of the flexible wiring board adjacent to the stacked wiring section. <P>COPYRIGHT: (C)2012,JPO&INPIT |
