发明名称 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor memory device having a structure in which an MTJ element hardly deteriorates in a manufacturing step even if the MTJ element is miniaturized. <P>SOLUTION: A semiconductor memory device according to an embodiment comprises a semiconductor substrate. A selection transistor is formed on the semiconductor substrate. A lower electrode is electrically connected to one diffusion layer of the selection transistor. A magnetic tunnel junction element is provided on the lower electrode. A first protection film is provided on the side face of the magnetic tunnel junction element. An upper electrode is provided on the magnetic tunnel junction element and the first protection film. A second protection film is provided on the side faces of the upper electrode, the first protection film, and the lower electrode. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059805(A) 申请公布日期 2012.03.22
申请号 JP20100199658 申请日期 2010.09.07
申请人 TOSHIBA CORP 发明人 IWAYAMA MASAYOSHI;KANETANI HIROYUKI
分类号 H01L27/105;H01L21/8246;H01L29/82;H01L43/08;H01L43/10 主分类号 H01L27/105
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