发明名称 LASER PATTERNING APPARATUS AND LASER PATTERNING METHOD
摘要 Aspects of the invention are directed to laser patterning apparatus capable of performing laser patterning on a thin film formed on a flexible substrate with a good yield and a laser patterning method thereof. The thin film formed on the flexible substrate can be patterned by laser using a laser patterning apparatus that can include a processing stage that has a reference processing surface on which the flexible substrate having the thin film formed thereon is disposed, a wrinkle removing device that is configured as a mechanism for stretching an outer periphery of a processing region of the flexible substrate so that tension is applied outward in the width direction and forward and backward in the transporting direction, and a laser scanner that scans a predetermined line of the thin film formed on the flexible substrate while emitting a laser beam thereto.
申请公布号 US2012070932(A1) 申请公布日期 2012.03.22
申请号 US201113234825 申请日期 2011.09.16
申请人 TODA MASAAKI;SAWAYANAGI SATOSHI;FUJI ELECTRIC CO., LTD. 发明人 TODA MASAAKI;SAWAYANAGI SATOSHI
分类号 H01L31/18;B29C35/08 主分类号 H01L31/18
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