发明名称 |
LASER PATTERNING APPARATUS AND LASER PATTERNING METHOD |
摘要 |
Aspects of the invention are directed to laser patterning apparatus capable of performing laser patterning on a thin film formed on a flexible substrate with a good yield and a laser patterning method thereof. The thin film formed on the flexible substrate can be patterned by laser using a laser patterning apparatus that can include a processing stage that has a reference processing surface on which the flexible substrate having the thin film formed thereon is disposed, a wrinkle removing device that is configured as a mechanism for stretching an outer periphery of a processing region of the flexible substrate so that tension is applied outward in the width direction and forward and backward in the transporting direction, and a laser scanner that scans a predetermined line of the thin film formed on the flexible substrate while emitting a laser beam thereto. |
申请公布号 |
US2012070932(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201113234825 |
申请日期 |
2011.09.16 |
申请人 |
TODA MASAAKI;SAWAYANAGI SATOSHI;FUJI ELECTRIC CO., LTD. |
发明人 |
TODA MASAAKI;SAWAYANAGI SATOSHI |
分类号 |
H01L31/18;B29C35/08 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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