发明名称 ONE-PIECE MOLDED BODY
摘要 <p>A technique whereby phosphorus compounds do not inhibit the curing of an addition reaction type silicone composition, even if the addition reaction type silicone composition comes into contact with a resin molding containing a phosphorus compound, is provided. A molded body, which is provided with a thermoplastic resin molded body containing a phosphorus compound, an addition reaction type silicone composition, and a member, and in which the thermoplastic resin molded body and the addition reaction type silicone composition come into contact, wherein a pentavalent phosphorus compound is used as the phosphorus compound. The thermoplastic resin molded body preferably contains polybutylene terephthalate resin for thermal resistance reasons.</p>
申请公布号 WO2012035922(A1) 申请公布日期 2012.03.22
申请号 WO2011JP68614 申请日期 2011.08.17
申请人 POLYPLASTICS CO., LTD.;SAKATA, KOUICHI 发明人 SAKATA, KOUICHI
分类号 C08J5/12;B32B27/00;B32B27/18;C08K5/521;C08K5/5313;C08L67/02 主分类号 C08J5/12
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