发明名称 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METAL MOLD, AND SEALING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent resin burrs from being formed on a rear surface of a die pad by conducting a simple procedure. <P>SOLUTION: A rear surface of a die pad 114, which is the side opposite to one surface of the die pad 114, is formed so as to be exposed from one surface of a sealing resin 130. Further, recessed parts 126, which are respectively arranged along at least a first side of an outermost edge of a center part structure 109 and a second side located adjacent to the first side, are provided on one surface of the sealing resin 130. The depth of each recessed part 126 is set so as to be larger than the height of the outermost edge of the center part structure. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012060105(A) 申请公布日期 2012.03.22
申请号 JP20110110778 申请日期 2011.05.17
申请人 RENESAS ELECTRONICS CORP 发明人 NISHIKAWA KENJI
分类号 H01L21/56;H01L23/28 主分类号 H01L21/56
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